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The 610021 is a 0.71mm 60/40 grade No-clean Residue Cored Solder Wire, made of Sn and Pb alloy. The Crystal? cored wire is manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%, the superior performance of the Crystal products may allow a lower flux content to be specified. This will further improve residue appearance by reducing the quantity. . Fast soldering - Range of activities to suit all applications . Good spread on copper, brass and nickel . Clear residues . Heat stable, low spitting . Mild odour

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 638135 is a RMA Liquid flux with a proprietary formulation that combines superior mobility and spread with faster initial wetting action. It is more effective and will maintain operating activity longer than conventional RMA type fluxes. It can be reliably and used where the solderability of an assembly needs an active flux formulation approaching an RA type but specifications mandate an RMA flux. As a result, it is ideal for use with multilayer, surface mount, densely populated and complex boards. Solder spread is up to 50% greater than conventional RMA fluxes assuring excellent penetration of plated through hole. It is ideal for single and double-sided PTH boards as well as multilayer and bottom-side SMD applications. . Results in faster throughput, fewer defects and less touch-up . Eliminates solder build-up . Flux residues are easily removed where required

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 3099925-M is a rosin based cored Solder Wire made of lead-free alloy. Multicore 309 cored wire is manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%. Multicore 309 cored wire is available in a variety of alloys conforming to J-STD-006 and EN 29453 or alloys conforming to similar national or international standards. The alloys used for Multicore flux cored solder wire conforms to the purity requirements of the common national and international standards. Multicore 309 solid flux is based on a blend of novel activators and resins. It has a mild characteristic odour and leaves a clear pale residue. . Rosin based . Fast soldering . Pale residues . Solders difficult surfaces . Good spread on nickel, stainless steel, Chromel, Monel, Constantin etc. . Heat stable, low fuming . Mild odour

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 495 20G is a 20g general purpose low viscosity Cyanoacrylate Instant Adhesive is a colourless transparent with 80 to 93.4°C flash point, suitable for plastics, suited for polyolefin"s in combination with primer, suited for rubbers, suited for metals. . -40 to 80°C Service temperature range . 30MPa Viscosity . Chemical stability is stable

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The LOCTITE 5400 series medium strength acrylic Pipe Sealant designed for the locking and sealing of metal threaded pipes and fittings. The product cures when confined in the absence of air between close fitting metal surfaces and prevents loosening and leakage from shock and vibration. The thixotropic nature of LOCTITE? 5400? reduces the migration of liquid product after application to the substrate. . Dimethacrylate ester chemical type . Positive under UV light fluorescence . High and thixotropic viscosity Not recommended for use in pure oxygen or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 610008 is a 0.71mm 60/40 grade No-clean Residue Cored Solder Wire, made of Sn and Pb alloy. The Crystal? cored wire is manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%, the superior performance of the Crystal products may allow a lower flux content to be specified. This will further improve residue appearance by reducing the quantity. . Fast soldering - Range of activities to suit all applications . Good spread on copper, brass and nickel . Clear residues . Heat stable, low spitting . Mild odour

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The D6192 is a Solder Wire, 60, 40 Sn, Pb alloy content, 0.039-inch external diameter and 180°C melting temperature.

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The DLMP22 500G REEL is a rosin based cored Solder Wire made of 99.3Sn0.7Cu alloy. Multicore 362 and 366 cored wire is manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%. Multicore 362 and 366 cored wire is available in a variety of alloys conforming to J-STD-006 and EN 29453 or alloys conforming to similar national or international standards. The alloys used for Multicore flux cored solder wire conforms to the purity requirements of the common national and international standards. Multicore 362 and 366 solid flux leave dry and non-sticky residues. In use its odour is typically that of rosin fluxes. Multicore flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. . Good wetting on most common surfaces . Non-corrosive . Fast soldering . Rosin based . Halide activated . Two activity levels, Multicore 362 for general work and Multicore 366 for more difficult surfaces

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 270 10ML is a 10ml Acrylic Adhesive with bottle dispensing method, green liquid appearance with characteristic odour, Greater than 65°C initial boiling point, 110°C flash point. This cyanoacrylate adhesive is stable under recommended storage conditions. . Carbon oxides hazardous decomposition Use only in well-ventilated areas. Avoid skin and eye contact.

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 5029725-M is a 0.7mm 99.3/0.7 grade Lead-free Solder Wire, made of Sn and Cu alloy. The cored wire is manufactured with a range of flux contents and although users will normally be using products with a nominal flux content of 3%, the superior performance of this product may allow a lower flux content to be specified. This will further improve residue appearance by reducing the quantity. . Halide-free version . Fast soldering - Range of activities to suit all applications . Good spread on copper, brass and nickel . Clear residues . Heat stable, low spitting

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 737196 is a rosin based cored Solder Wire made of lead-free alloy. Multicore 309 cored wire is manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%. Multicore 309 cored wire is available in a variety of alloys conforming to J-STD-006 and EN 29453 or alloys conforming to similar national or international standards. The alloys used for Multicore flux cored solder wire conforms to the purity requirements of the common national and international standards. Multicore 309 solid flux is based on a blend of novel activators and resins. It has a mild characteristic odour and leaves a clear pale residue. . Rosin based . Fast soldering . Pale residues . Solders difficult surfaces . Good spread on nickel, stainless steel, Chromel, Monel, Constantin etc. . Heat stable, low fuming . Mild odour

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 984569 is a Nozzle Mixer for epoxy, polyurethanes and silane modified polymers, 1:1, 2:1, 50ml.

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The LOCTITE 460 series Alkoxyethyl Cyanoacrylate Adhesive has low odour and low blooming properties and is particularly suitable for applications where vapour control is difficult. The product provides rapid bonding of a wide range of materials, including metals, plastics and elastomers. LOCTITE? 460? is particularly suited for bonding porous or absorbent materials such as wood, paper, leather and fabric. Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24-hour before full chemical/solvent resistance is developed. The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure. The rate of cure will depend on the ambient relative humidity. The best results are achieved when the relative humidity in the working environment is 40 to 60% at 22°C. . Low viscosity . Humidity cure Not recommended for use in pure oxygen or oxygen rich system and should not be selected as a sealant for chlorine or other strong oxidizing materials.

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 496 20G is a 20g medium viscosity general purpose Adhesive, particularly suited to bonding of metal substrates. It is in liquid form, colourless with irritating odour and polymerises in presence of water soluble. . >149°C Boiling point . 80 to 93.4°C Flash point

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The LOCTITE 8065 series Anti-seize Lubricant provides a shield against high temperature seizing and galling. All mated parts, studs, bolts, flanges and gaskets, remove more easily and in cleaner and better condition. This product can be used on copper, brass, cast iron, steel, all alloys including stainless steel, all plastics and all non-metallic gasketing materials. Typical applications include original equipment and maintenance and equipment associated with petroleum chemicals, steel mills, power plants, marine and foundries. This product is typically used in applications up to 982°C. An anti-seize lubricant used on a bolt helps to develop greater clamp load for the same torque compared to an unlubricated bolt. An additional benefit is greater uniformity in clamp load among a series of bolts. Not recommended for use in pure oxygen or oxygen rich systems and should not be selected as a lubricant for chlorine or other strong oxidizing materials.

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 628904 is a 1mm 96.5/3/0.5 grade Lead-free Flux Cored Solder Wire, made of Sn/Ag/Cu alloy. This cored wire is manufactured with a range of flux contents and although users will normally be using product with a nominal flux content of 3%. . Rosin based . Fast soldering . Pale residues . Solders difficult surfaces . Heat stable, low fuming . Mild odour

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

The 728773 is an aerosol Quick Gasket Sealant. It cures to a permanently flexible, reliable and long lasting gasket. The unique even-flow nozzle is very easy to use and allows dispensing with extra accuracy. The product can also replace cut gaskets. . Continuous Service Temperature up to 200°C, Intermittent up to 260°C . One Can Contains Enough Product to Produce up to 10 Mid-sized Engine Oil Sump Gaskets . Withstands All Shop Fluids (Oil, Coolant, ATF) . No Odour . Up to 0.25mm at 0.35-bar Instant Sealing Performance . Easy to Use

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

最新賣價(jià)	包裝	應(yīng)用	系列	電壓電源	工作溫度	封裝外殼

型號：

LOCTITE GC 10 SAC305T4 885V 53K

The LOCTITE GC 10 SAC305T4 885V 53K is a halogen-free/no-clean/low Voiding/Pb-free Solder Paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallization including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. . Eliminates the need and expense of cleaning . Halogen-free flux classification, ROL0 to ANSI/J-STD-004 Rev. B . Printing, down to 0.3mm pitch . Printing, up to 72 hours stencil life . Printing, up to 24 hours abandon time . Printing, suitable for high-speed printing up to 125 mms-1 . Printing, improved paste-transfer efficiency . Reflow, enhanced soak process window 150-200°C (temperature and time) . Reflow, enhanced process window with superior coalescence and wetting . Reflow, minimal hot slump at 182°C . Reflow, superior coalescence and wetting on small components including 01005 . Reflow, very shiny solder joints . Reflow, clear, colourless residues for easy post-reflow inspection . Reflow, residues print testable after 4x reflows

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